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CMOS : circuit design, layout, and simulation
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CMOS : circuit design, layout, and simulation

Author: R Jacob Baker
Publisher: Hoboken, N.J. : IEEE Press/Wiley, 2010.
Series: IEEE Press series on microelectronic systems.
Edition/Format:   eBook : Document : English : 3rd edView all editions and formats
Summary:
"The third edition of CMOS: Circuit Design, Layout, and Simulation continues to cover the practical design of both analog and digital integrated circuits, offering a vital, contemporary view of a wide range of analog/digital circuit blocks, the BSIM model, data converter architectures, and much more. The 3rd edition completes the revised 2nd edition by adding one more chapter (chapter 30) at the end, which describes
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Details

Genre/Form: Electronic books
Additional Physical Format: Print version:
Baker, R. Jacob, 1964-
CMOS.
Hoboken, N.J. : IEEE Press/Wiley, 2010
(DLC) 2010016630
(OCoLC)609304961
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: R Jacob Baker
ISBN: 9780470891162 0470891165
OCLC Number: 680017841
Description: 1 online resource (xxxiii, 1173 p.) : ill.
Contents: CMOS Circuit Design, Layout, and Simulation; Contents; Preface; Chapter 1 Introduction to CMOS Design; Chapter 2 The Well; Chapter 3 The Metal Layers; Chapter 4 The Active and Poly Layers; Chapter 5 Resistors, Capacitors, MOSFETs; Chapter 6 MOSFET Operation; Chapter 7 CMOS Fabrication; Chapter 8 Electrical Noise: An Overview; Chapter 9 Models for Analog Design; Chapter 10 Models for Digital Design; Chapter 11 The Inverter; Chapter 12 Static Logic Gates; Chapter 13 Clocked Circuits; Chapter 14 Dynamic Logic Gates; Chapter 15 VLSI Layout Examples; Chapter 16 Memory Circuits
Series Title: IEEE Press series on microelectronic systems.
Responsibility: R. Jacob Baker.

Abstract:

The third edition of CMOS: Circuit Design, Layout, and Simulation continues tocover the practical design of both analog and digital integrated circuits, offering a vital, contemporary view of a wide  Read more...
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